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How To Properly Mix EPO-TEK Epoxies
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EPO-TEK – Technical Data Sheet
H20E. Technical Data Sheet. For Reference Only. Electrically Conductive, Silver Epoxy. Number of Components: Two. Frozen Syringe.
Source: www.pg.infn.it
Date Published: 9/5/2021
View: 4229
EPO-TEK® H20E – QP Technologies
H20E. Technical Data Sheet. For Reference Only. Electrically Conductive, Silver Epoxy. Number of Components: Two. Frozen Syringe.
Source: www.qptechnologies.com
Date Published: 1/27/2022
View: 8679
Epo-Tek® H20E Adhesive – Electron Microscopy Sciences
EPO-TEK® H20E is a two-component, 100% sols silver-filled epoxy system designed for chip bonding in microelectronic and optoelectronic applications.
Source: www.emsdiasum.com
Date Published: 5/21/2022
View: 3292
SAFETY DATA SHEET EPO-TEK® H20E Part A
Contains. Epoxy Phenol Novolac. Other hazards. Harmful dust may be released during cutting or grinding process. Hazards not otherwise ified (HNOC).
Source: www.uni-muenster.de
Date Published: 2/4/2021
View: 8088
Top 14 h20e – marvelvietnam.com
EPO-TEK® H20E is a two-component, 100% sols silver-filled epoxy system designed for chip bonding in … [PDF] Technical Data Sheet – QP Technologies …
Source: marvelvietnam.com
Date Published: 3/21/2022
View: 4761
EPO-TEK® H20E-FC | EPFL
EPO-TEK® H20E-FC. Technical Data Sheet. For Reference Only. Electrically Conductive Epoxy. Epoxies and Adhesives for Demanding Applications™.
Source: www.epfl.ch
Date Published: 7/18/2022
View: 5048
Epoxy Technology EPO-TEK® H20E Electrically Conductive …
Product Description: EPO-TEK® H20E is a two component, 100% sols silver-filled epoxy system designed specifically for chip bonding in microelectronic and …
Source: www.lookpolymers.com
Date Published: 1/21/2021
View: 1961
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- Author: Epoxy Technology Inc.
- Views: 조회수 9,049회
- Likes: 좋아요 18개
- Date Published: 2015. 2. 18.
- Video Url link: https://www.youtube.com/watch?v=Mc5RGfMmZZU
Epo-Tek H20S Adhesive
Epo-Tek® H20E Adhesive
EMS #12671-20E
EPO-TEK® H20E is a two-component, 100% solids silver-filled epoxy system designed for chip bonding in microelectronic and optoelectronic applications. It is also used for thermal management applications due to its high thermal conductivity. It is a reliable system, making it the conductive adhesive of choice for new applications. In addition, it is also available in single component frozen syringe.
Technical Information
Composition Properties
Number of Components Two Mix Ratio by Weight 1:1 Specific Gravity Part A: 2.03
Part B: 3.07
(Frozen Syringe: 2.67) Pot Life 2.5 Days Shelf Life One year at 23°C
(Frozen Syringe: One year at -40°C)
Minimum Bond Line Cure Schedule
175°C 45 seconds 150°C 5 minutes 120°C 15 minutes 100°C 2 hours 80°C 3 hours
Note: Container should be kept closed when not in use. For filled systems, mix contents of each container (A&B) thoroughly before mixing the two together.
Epo-Tek® H20E Advantages and Application Notes
Processing Information: It can be applied to many dispensing, stamping, and screen printing techniques
Dispensing: Compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion
Screen Printing: Best using >200 metal mesh, with polymer squeegee blade with 80D hardness
Stamping: Small dots 6 mil in diameter can be realized
Miscellaneous/Other Notes
Many technical papers written over 30-40 year lifetime
Over 1 trillion chips attached at a single company
Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hit plate, IR, convection, br inductor coil
Many custom modified products available for the following improvements: viscosity and appearance, flexibility, and thermal conductivity
Typical Properties
To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield different results; Cure condition: 150°C/1 hour; * Denotes test on lot acceptance basis.
Physical Properties
*Color Part A: Silver
Part B: Silver *Consistancy Smooth, thixotropic paste *Viscosity (@ 100 RPM/23°C) 2,200-3,200 cPs Thixotropic Index 4.63 *Glass Transition Temp. (Tg) ≥80°C (Dynamic cure 20-200°C/ISO 25 min; Ramp -10 to 200°C @ 20°C/min) Coefficient of Thermal Expansion (CTE): Below Tg: 31 x 10-6 in/in/°C
Above Tg: 158 x n10-6 in/in/°C Shore D Hardness 75 Lap Shear Strength @ 23°C 1,475 psi Die Shear Strength @ 23°C >10 Kg/3,400 psi Degradation Temp. (TGA) 425°C Weight Loss @ 200°C: 0.59%
@ 250°C: 1.09%
@ 300°C: 1.67% Operating Temp. Continuous: -55°C to 200°C
Intermittent: -55°C to 300°C Storage Modulus @ 23°C 808,700 psi Ions C1-: 73 ppm
Na+: 2 ppm
NH 4 +: 98 ppm
K+: 3 ppm *Particle Size ≤45 microns
Electrical Properties
*Viscosity Resistivity @ 23°C ≤0.0004 Ohm-cm
Thermal Properties
Thermal Conductivity 2.5 W/mK
Based on standard method: Laser flash Thermal Conductivity 25 W/mK
Based on thermal resistance data: R = L x K-1 x A-1 Thermal Resistance (Junction to Case) TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with EPO-TEK® H20E (2 mils thick)
Epo-Tek® H20E: 6.7 to 7.0°C/W
Solder: 4.0 to 5.0°C/W
Epo-Tek®H20E Suggested Applications
Semiconductor IC Packaging
Die-attaching chips to leadframes; compatible with Si and MEM’s chips, 260°C lead-free reflow and JEDEC Level 1 packaging requirements
Capable of being snap cured in-line, as well as traditional box oven techniques
Adhesive for solderless flip chip packaging and ultra-fine pitch SMD printing
Hybrid Micro-Electronics
A comparable alternative to solder and eutectic die attach, in terms of thermal performance; very commonly no more than 1-2°C/watt difference in thermal resistance
Die-attaching of quartz crystal oscillators (QCO) to the Au posts of TO-can style lead frame
Used with GaAs chips for microwave/radar application up to 77GHz Compatible with Au, Ag, Ag-Pd terminations of capacitors and resistor SMDs
NASA approved low outgassing adhesive
Adhesive for EMI and Rf shielding of Rf, microwave and IR devices
Electronic & PCB Circuit Assembly
Used to make electrical contacts in acoustical applications of speakers/microphones
Electrical connection of piezo’s to PCB. Oads of PZT are connected to many kinds of circuits using H20E, including ink jet heads, MEMs and ultrasound devices
Automotive applications include pressure sensing and accelerometer circuits
Electrically conductive adhesive (ECA) for connections of circuits to Cu coils in Rf antenna applications such as smart cards and RFID tags
ECA for attaching SMDs to membrane switch flex circuits. Compatible with Ag-PTF and carbon graphite PCB pads. A low temperature “solder-free” solution
Solar-Photovoltaic industry ECA for the electrical connection of transparent conductive oxide (TCO) to PCB pads Replacement of solder joints of Cu/Sn ribbon wire, from cell-to-cell; a common “solar cell stringing” adhesive Die-attach of III-V semiconductor chips to substrates using Cu, BeO, aluminum nitride, etc.
Ability to be dispensed in high volumes via dots, arrays, and writing methods
Medical Applications
USP Class VI adhesive for circuits requiring implantation/biocompatibility
Die-attaching photo diode arrays in X-ray circuits
Vibration resistant adhesive for ultrasound applications <20 MHz frequency; making the electrical connection of PZT to Au/PCB substrate Electrical connections of die, SMFs and QCO for pacemaker hybrid circuits A common ECA for hearing aid applications using hybrid, ECM or MEMs technology Opto-Electronic Packaging Applications Adhesive for fiber optic components using DIP, Butterfly or custom hybrid IC packages. As an ECA it attaches waveguides, die bonds laser diodes and hear sinks the high power laser circuits Die-attaching IR-detector chips onto PCBs or TO-can style headers Die-attaching LED chips to substrates using single chip packages, or arrays Adhesion to Ag, Au, and Cu plated leadframes and PCBs Electrical connection of ITO to PCBs found in LCD industry A low temp ECA for OLED displays and organically printable electronics Product Information Epo-Tek® H20E Adhesive
Top 14 h20e
188,95 US$ H20E is used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many … …
Tác giả: www.fishersci.com
Ngày đăng: 17/12/2020
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Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy datasheet
Material Notes:
Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.Advantages & Application Notes:Processing info: It can be applied by many dispensing, stamping and screen printing techniques.Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion. Screen Printing: best using >200 metal mesh, with polymer squeegee blade with 80D hardness.Stamping: small dots 6 mil in diameter can be realized. Misc / Other notes: Many technical papers written over 30-40 year lifetime. Over 1 trillion chips attached at a single company: no failures, Six Sigma and Certified Parts Supplier award winner.Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil.Many custom modified products available, for the following improvements: viscosity and appearance, flexibility and thermal conductivity. Information Provided by Epoxy Technology
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